Product Description
Features: SD Card, USB-C, & Wi-Fi Printing, Up to 250 mm/s Printing Speed, ABS, ASA, HIPS, PC, PETG, PLA, & TPU, 0.05 to 0.35 mm Layer Resolution, 1.75mm Filament Diameter, 8.7 x 8.7 x 11-inch Build Area, FDM Printing Technology, Heated Print Bed, CR Touch Auto Leveling, Interactive Touch-Screen Controls
Print Technology: Fused Filament Fabrication (FFF) - Marketed as Fused Deposition Modeling (FDM)
Build Volume: 8.7 x 8.7 x 11-inch / 22.0 x 22 x 28.0 cm (1 Extruder)
Number of Extruders: 1
Layer Resolution: 50 to 350 micron / 0.05 to 0.35 mm
Supported Extruder Nozzle Diameter: 0.4 mm (Included)
Extruder Nozzle Temperature: 572 degreesF / 300 degreesC
Print Speed: 250 mm/s
Filament Compatibility: 1.75 mm Diameter: ABS - ASA - HIPS - PC - PETG - PLA - TPU
Build Area Type: Open
Extendable: No
Build Plate Features: Auto Leveling - Heated
Build Plate Temperature: 230 degreesF / 110 degreesC
Build Plate Composition: Steel
Filament Spool Storage: External
System Connection: 1x USB-C
Wireless: No
Media/Memory Card Slot: Single Slot: SD/SDHC
Supported 3D File Types: .amf - .obj - .stl
Input Power: 100 to 240 VAC - 50 / 60 Hz
Dimensions (W x H x D): 16.7 x 18.1 x 22.4-inch / 425 x 460 x 570 mm
Weight: 26.7 lb / 12.1 kg